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030062: Composite metal Matrix Castings and Solder Compositions and Methods for Microelectronics and Metal Matrix Castings

The rapid advance in the miniaturization of electronic components require novel soldering solutions with sub-micron reinforcements. Sub-micron reinforcements can minimize grain boundary sliding. Another challenge is increased current density in Micro-Electro-Mechanical Systems (MEMS). Ion migration across electrodes causes voids and ultimately solder...
Published: 7/21/2014   |   Inventor(s): Karatholuvu Subramanian, Andre Lee
Keywords(s): Castings, Dispersion, Lead-free Solder, Microelectronics, Shear Strength, Solder Paste Category(s): Electrical, Materials, Nanotechnology